Authors: Titu-Marius I. Băjenescu
Superior Title: Journal of Engineering Science (Chişinău), Vol XXVI, Iss 1, Pp 65-82 (2019)
Subject Terms: Process errors, MEMS, optical MEMS, failure analysis, MEMS switches, package cracking, failure mechanisms, reliability, creep, lifetime prediction, Engineering (General). Civil engineering (General), TA1-2040, Electronic computers. Computer science, QA75.5-76.95
File Description: electronic resource
Authors: Băjenescu, Titu-Marius I.
Superior Title: Journal of Engineering Science XXVI (1) 65-82
Subject Terms: Process errors, MEMS, optical MEMS, failure analysis, MEMS switches, package cracking, failure mechanisms, reliability, creep, lifetime prediction
Relation: https://zenodo.org/communities/jes_utm; https://zenodo.org/record/2640042; https://doi.org/10.5281/zenodo.2640042; oai:zenodo.org:2640042
Authors: Nakagawa, Osamu, Shimamoto, Haruo, Ueda, Tetsuya, Shimomura, Kou, Hata, Tsutomu, Tachikawa, Toru, Fukushima, Jiro, Banjo, Toshinobu, Yamamoto, Isamu
Superior Title: Journal of Electronic Materials. September 1989 18(5):633-643