Authors: Yu Wang, Yu‐jia Zou, Xiaojie Dang, Ming‐da Zhu, Xun‐wang Zhao, Yu Zhang
Superior Title: Electronics Letters, Vol 60, Iss 3, Pp n/a-n/a (2024)
Subject Terms: dielectric materials, integral equations, method of moments, Electrical engineering. Electronics. Nuclear engineering, TK1-9971
File Description: electronic resource
Authors: Ying-Yu Liu, Ming-Da Zhu, Chang Zhai, Peng Hou, Yu Zhang
Superior Title: IEEE Access, Vol 8, Pp 140661-140672 (2020)
Subject Terms: Matrix partitioning, domain decomposition, surface integral equations, out-of-core solver, Electrical engineering. Electronics. Nuclear engineering, TK1-9971
File Description: electronic resource
Authors: Tapan K. Sarkar, Magdalena Salazar-Palma, Ming Da Zhu, Heng Chen
Resource Type: eBook.
Categories: SCIENCE / Physics / Electromagnetism
Authors: Ming-Da Zhu, Xi-Lang Zhou, Wen-Yan Yin
Superior Title: 2010 IEEE International Symposium on Electromagnetic Compatibility
Authors: Wei Luo, Wen-Yan Yin, Ming-Da Zhu, Jun-Fa Mao, Jian-Yao Zhao
Superior Title: IEEE Transactions on Electromagnetic Compatibility ; volume 54, issue 5, page 1006-1016 ; ISSN 0018-9375 1558-187X
Subject Terms: Electrical and Electronic Engineering, Condensed Matter Physics, Atomic and Molecular Physics, and Optics
Authors: Ming-Da Zhu, Xi-Lang Zhou, Wen-Yan Yin
Superior Title: IEEE Antennas and Wireless Propagation Letters ; volume 10, page 792-795 ; ISSN 1536-1225 1548-5757
Subject Terms: Electrical and Electronic Engineering
Authors: Yizhi Wu, Xieyun Xu, Ming-Da Zhu
Superior Title: Progress in Electromagnetics Research Letters; 2016, Vol. 64, p119-126, 8p
Authors: Ming-Da Zhu, Xi-Lang Zhou, Wen-Yan Yin
Superior Title: 2011 IEEE International Symposium on Electromagnetic Compatibility (EMC); 2011, p585-590, 6p
Authors: Wei Luo, Wen-Yan Yin, Ming-Da Zhu, Jun-Fa Mao
Superior Title: 2011 IEEE International Symposium on Electromagnetic Compatibility (EMC); 2011, p579-584, 6p
Authors: Wei Luo, Jian-Yao Zhao, Ming-Da Zhu, Wen-Yan Yin
Superior Title: IEEE Antennas & Wireless Propagation Letters; 2014, Vol. 13, p1465-1468, 4p