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4
eBook

Authors: Matsumoto, TakashiAff26, Kibi, YurieAff27, Kondo, TetsuroAff28

Contributors: Goos, Gerhard, Series EditorAff1, Hartmanis, Juris, Founding EditorAff2, van Leeuwen, Jan, Series EditorAff3, Hutchison, David, Editorial Board MemberAff4, Kanade, Takeo, Editorial Board MemberAff5, Kittler, Josef, Editorial Board MemberAff6, Kleinberg, Jon M., Editorial Board MemberAff7, Kobsa, Alfred, Series EditorAff8, Mattern, Friedemann, Editorial Board MemberAff9, Mitchell, John C., Editorial Board MemberAff10, Naor, Moni, Editorial Board MemberAff11, Nierstrasz, Oscar, Series EditorAff12, Pandu Rangan, C., Editorial Board MemberAff13, Sudan, Madhu, Series EditorAff14, Terzopoulos, Demetri, Editorial Board MemberAff15, Tygar, Doug, Editorial Board MemberAff16, Deshpande, R.D., Series EditorAff17, Vardi, Moshe Y, Series EditorAff18, Bertino, Elisa, Editorial Board MemberAff19, Gao, Wen, Editorial Board MemberAff20, Steffen, Bernhard, Editorial Board MemberAff21, Yung, Moti, Editorial Board MemberAff22, Woeginger, Gerhard, Editorial Board MemberAff23, Streitz, Norbert A., editorAff24, Konomi, Shin'ichi, editorAff25

Superior Title: Distributed, Ambient and Pervasive Interactions : 12th International Conference, DAPI 2024, Held as Part of the 26th HCI International Conference, HCII 2024, Washington, DC, USA, June 29 – July 4, 2024, Proceedings, Part I. 14718:110-129

9
Academic Journal
15
eBook

Authors: Matsumoto, TakashiAff9, Aff10, Kimura, MikaAff10, Sumiya, TerukaAff11, Aff12, Sasao, TomoyoAff9

Contributors: Goos, Gerhard, Founding EditorAff1, Hartmanis, Juris, Founding EditorAff2, Bertino, Elisa, Editorial Board MemberAff3, Gao, Wen, Editorial Board MemberAff4, Steffen, Bernhard, Editorial Board MemberAff5, Yung, Moti, Editorial Board MemberAff6, Streitz, Norbert A., editorAff7, Konomi, Shin'ichi, editorAff8

Superior Title: Distributed, Ambient and Pervasive Interactions : 11th International Conference, DAPI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23–28, 2023, Proceedings, Part II. 14037:97-117

16
eBook

Authors: Chea, BunyaAff12, Aff13, Chaisomphob, TaweepAff12, Matsumoto, TakashiAff14

Contributors: di Prisco, Marco, Series EditorAff1, Chen, Sheng-Hong, Series EditorAff2, Vayas, Ioannis, Series EditorAff3, Kumar Shukla, Sanjay, Series EditorAff4, Sharma, Anuj, Series EditorAff5, Kumar, Nagesh, Series EditorAff6, Wang, Chien Ming, Series EditorAff7, Geng, Guoqing, editorAff8, Qian, Xudong, editorAff9, Poh, Leong Hien, editorAff10, Pang, Sze Dai, editorAff11

Superior Title: Proceedings of The 17th East Asian-Pacific Conference on Structural Engineering and Construction, 2022 : EASEC-17, Singapore. 302:448-457