Authors: Gernhardt, R., Wöhrmann, M., Müller, F., Hauck, K., Töpper, M., Lang, K.-D., Hichri, H., Arendt, M.
Time: 621
Relation: International Wafer Level Packaging Conference (IWLPC) 2019; International Wafer Level Packaging Conference, IWLPC 2019; https://publica.fraunhofer.de/handle/publica/410725
Authors: Woehrmann, M., Hichri, H., Gernhardt, R., Hauck, K., Braun, T., Toepper, M., Arendt, M., Lang, K.-D.
Relation: Electronic Components and Technology Conference (ECTC) 2017; ECTC 2017, the 67th Electronic Components and Technology Conference; https://publica.fraunhofer.de/handle/publica/397989
Authors: McGahay, V., Bonilla, G., Chen, F., Christiansen, C., Cohen, S., Cullinan-Scholl, M., Demarest, J., Dunn, D., Engel, B., Fitzsimmons, J., Gill, J., Grunow, S., Herbst, B., Hichri, H., Ida, K., Klymko, N., Kiene, M., Labelle, C., Lee, T., Liniger, E., Liu, X.H., Madan, A., Malone, K., Martin, J., McLaughlin, P.V., Minami, P., Molis, S., Muzzy, C., Nguyen, S., Patel, J.C., Restaino, D., Sakamoto, A., Shaw, T.M., Shimooka, Y., Shobha, H., Simonyi, E., Widodo, J., Grill, A., Hannon, R., Lane, M., Nye, H., Spooner, T., Wisnieff, R., Ivers, T.
Superior Title: 2006 International Interconnect Technology Conference
Authors: Leobandung, E., Nayakama, H., Mocuta, D., Miyamoto, K., Angyal, M., Meer, H.V., McStay, K., Ahsan, I., Allen, S., Azuma, A., Belyansky, M., Bentum, R.-V., Cheng, J., Chidambarrao, D., Dirahoui, B., Fukasawa, M., Gerhardt, M., Gribelyuk, M., Halle, S., Harifuchi, H., Harmon, D., Heaps-Nelson, J., Hichri, H., Ida, K., Inohara, M., Inoue, K., Jenkins, K., Kawamura, T., Kim, B., Ku, S.-K., Kumar, M., Lane, S., Liebmann, L., Logan, R., Melville, I., Miyashita, K., Mocuta, A., O'Neil, P., Ng, M.-F., Nogami, T., Nomura, A., Norris, C., Nowak, E., Ono, M., Panda, S., Penny, C., Radens, C., Ramachandran, R., Ray, A., Rhee, S.-H., Ryan, D., Shinohara, T., Sudo, G., Sugaya, F., Strane, J., Tan, Y., Tsou, L., Wang, L., Wirbeleit, F., Wu, S., Yamashita, T., Yan, H., Ye, Q., Yoneyama, D., Zamdmer, N., Zhong, H., Zhu, H., Zhu, W., Agnello, P., Bukofsky, S., Bronner, G., Crabb, E., Freeman, G., Huang, S.-F., Ivers, T., Kuroda, H., McHerron, D., Pellerin, J., Toyoshima, Y., Subbanna, S., Kepler, N., Su, L.
Superior Title: Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005.
Authors: DellaGuardia, Ronald, Kwong, Ranee W., Li, Wenjie, Lawson, Peggy, Burkhardt, Martin, Grauer, Ioana C., Wu, Qiang, Angyal, M., Hichri, H., Melville, Ian, Kumar, K., Lin, Y., Holmes, Steven J., Varanasi, R., Spooner, T., McHerron, D.
Contributors: Smith, Bruce W.
Superior Title: SPIE Proceedings ; Optical Microlithography XVII ; ISSN 0277-786X
Availability: https://doi.org/10.1117/12.544238
Authors: Hichri, H., Bazi, Y., Alajlan, N., Malek, S.
Superior Title: IEEE Geoscience and Remote Sensing Letters ; volume 10, issue 2, page 298-302 ; ISSN 1545-598X 1558-0571
Subject Terms: Electrical and Electronic Engineering, Geotechnical Engineering and Engineering Geology
Authors: Islam, M. S., Alajlan, N., Bazi, Y., Hichri, H. S.
Superior Title: IEEE Transactions on Information Technology in Biomedicine ; volume 16, issue 3, page 445-453 ; ISSN 1089-7771 1558-0032
Subject Terms: Electrical and Electronic Engineering, Computer Science Applications, General Medicine, Biotechnology
Authors: McCandless, B.E., Hichri, H., Hanket, G., Birkmire, R.W.
Superior Title: Conference Record of the Twenty Fifth IEEE Photovoltaic Specialists Conference - 1996
Authors: Orbey, N., Hichri, H., Birkmire, R.W., Russell, T.W.F.
Superior Title: Conference Record of the Twenty Fifth IEEE Photovoltaic Specialists Conference - 1996
Authors: Birkmire, R. W., Hichri, H., Klenk, R., Marudachalam, M., McCandless, B. E., Phillips, J. E., Schultz, J. M., Shafarman, W. N.
Superior Title: AIP Conference Proceedings ; ISSN 0094-243X
Availability: https://doi.org/10.1063/1.49370
Authors: Orbey, N., Hichri, H., Birkmire, R. W., Russell, T. W. F.
Superior Title: Progress in Photovoltaics: Research and Applications ; volume 5, issue 4, page 237-247 ; ISSN 1062-7995 1099-159X
Subject Terms: Electrical and Electronic Engineering, Condensed Matter Physics, Renewable Energy, Sustainability and the Environment, Electronic, Optical and Magnetic Materials
Availability: https://doi.org/10.1002/(sici)1099-159x(199707/08)5:4%3C237::aid-pip173%3E3.3.co%3B2-4
Authors: Marudachalam, M., Birkmire, R. W., Hichri, H., Schultz, J. M., Swartzlander, A., Al-Jassim, M. M.
Superior Title: Journal of Applied Physics ; volume 82, issue 6, page 2896-2905 ; ISSN 0021-8979 1089-7550
Subject Terms: General Physics and Astronomy
Superior Title: Applied Physics Letters ; volume 67, issue 26, page 3978-3980 ; ISSN 0003-6951 1077-3118
Subject Terms: Physics and Astronomy (miscellaneous)
Authors: Hichri, H., Accary, A., Puaux, J. P., Andrieu, J.
Superior Title: Industrial & Engineering Chemistry Research ; volume 31, issue 8, page 1864-1867 ; ISSN 0888-5885 1520-5045
Subject Terms: Industrial and Manufacturing Engineering, General Chemical Engineering, General Chemistry
Availability: https://doi.org/10.1021/ie00008a005
Authors: Alajlan, N., Ammour, N., Bazi, Y., Hichri, H.
Superior Title: 2010 IEEE International Geoscience & Remote Sensing Symposium (IGARSS) (9781457710032); 2011, p2896-2899, 4p
Authors: Marudachalam, M., Hichri, H.
Superior Title: Applied Physics Letters; 12/25/1995, Vol. 67 Issue 26, p3978, 3p, 1 Chart, 4 Graphs
Subject Terms: THIN films, X-ray diffraction, AUGER effect, SOLAR cells
Authors: Hichri, H., Birkmire, R. W., Russell, T. W. F., Orbey, N.
Superior Title: Progress in Photovoltaics; Jul/Aug1997, Vol. 5 Issue 4, p237, 0p
Subject Terms: SOLAR energy, TECHNOLOGY, TEMPERATURE, PHOTOVOLTAIC power generation, RENEWABLE energy sources, ENERGY development, COPPER compounds
Authors: H. Hichri, Y. Bazi, N. Alajlan, S. Malek
Contributors: Hichri, H., Bazi, Y., Alajlan, N., Malek, S.
Relation: volume:10; issue:2; firstpage:298; lastpage:302; numberofpages:5; journal:IEEE GEOSCIENCE AND REMOTE SENSING LETTERS; https://hdl.handle.net/11582/335978; https://ieeexplore.ieee.org/document/6244846