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Academic Journal

Authors: Kodali, Lata1 (AUTHOR) latak215@vt.edu, Sengupta, Srijan1 (AUTHOR), House, Leanna1 (AUTHOR), Woodall, William H.1 (AUTHOR)

Superior Title: Applied Stochastic Models in Business & Industry. Nov2020, Vol. 36 Issue 6, p980-1013. 34p.

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5
Academic Journal

Authors: Natkaniec, Marek1 (AUTHOR) bieryt.natalia@gmail.com, Bieryt, Natalia1 (AUTHOR)

Superior Title: Sensors (14248220). May2023, Vol. 23 Issue 10, p4964. 34p.

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Academic Journal
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Academic Journal

Authors: Van, Nguyen Thi Thanh1 van.nguyenthithanh@phenikaa-uni.edu.vn, Luong, Nguyen Cong2 luong.nguyencong@phenikaa-uni.edu.vn, Nguyen, Huy T.3 huynguyencse@gmail.com, Shaohan, Feng3 Feng_Shaohan@i2r.a-star.edu.sg, Niyato, Dusit4 DNIYATO@ntu.edu.sg, Kim, Dong In5 dikim@skku.ac.kr

Superior Title: IEEE Transactions on Vehicular Technology. Dec2021, Vol. 70 Issue 12, p13447-13452. 6p.

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Academic Journal

Authors: Jiang, Weiwen1 (AUTHOR) wjiang2@nd.edu, Lou, Qiuwen1 (AUTHOR) qlou@nd.edu, Yan, Zheyu1 (AUTHOR) zyan2@nd.edu, Yang, Lei1 (AUTHOR) yanglary@gmail.com, Hu, Jingtong2 (AUTHOR) jthu@pitt.edu, Hu, Xiaobo Sharon1 (AUTHOR) shu@nd.edu, Shi, Yiyu1 (AUTHOR) yshi4@nd.edu

Superior Title: IEEE Transactions on Computers. Apr2021, Vol. 70 Issue 4, p595-605. 11p.

14
Academic Journal

Authors: Wu, Qiong1,2 qiongwu@jiangnan.edu.cn, Zhang, Hao1 haozhang@vip.jiangnan.edu.cn, Li, Zhengquan2,3 aqiongwu@jiangnan.edu.cn, Liu, Yang1 ly71354@163.com, Zhang, Cui4 fair_cas@163.com

Superior Title: EURASIP Journal on Wireless Communications & Networking. 1/22/2018, Vol. 2018 Issue 1, p1-N.PAG. 9p.

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17
Academic Journal

Authors: Amzil, Abdellah1 (AUTHOR) a.amzil@uhp.ac.ma, Bellouch, Abdessamad1 (AUTHOR), Boujnoui, Ahmed1 (AUTHOR), Hanini, Mohamed1 (AUTHOR), Zaaloul, Abdellah2 (AUTHOR)

Superior Title: International Journal of Hybrid Intelligent Systems. 2022, Vol. 18 Issue 1/2, p53-68. 16p.

18
Academic Journal

Authors: Das, Tuhin Subhra1 (AUTHOR), Ghosal, Prasun1 (AUTHOR) p_ghosal@it.iiests.ac.in

Superior Title: International Journal of Electronics. Jul2019, Vol. 106 Issue 7, p1008-1028. 21p.

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