Authors: Sun, Haiyan¹ (AUTHOR) sun.yan@ntu.edu.cn, Gao, Bo¹ (AUTHOR) 948091944@qq.com, Zhao, Jicong¹ (AUTHOR) jczhao@ntu.edu.cn

Superior Title: Soldering & Surface Mount Technology. 2021, Vol. 33 Issue 3, p178-186. 9p.

Subject Terms: THERMAL fatigue, SOLDER & soldering, TAGUCHI methods, WAFER level packaging, FATIGUE life, COPPER