Authors: Thilmany, Jean

Superior Title: Mechanical Engineering. Sep2007, Vol. 129 Issue 9, p30-34. 5p.

Subject Terms: *INTEGRATED circuits, *COMPUTER-aided design, *HIGH technology, *ENGINEERING design, ELECTRONIC circuits, COMPUTER graphics, DIGITAL electronics, DIGITAL instrumentation, TRANSISTORS

Authors: Qiming Zhang, Lo, Jeffery C. C., Ricky Lee, S. W., Wei Xu

Superior Title: Journal of Electronic Packaging; Dec2018, Vol. 140 Issue 4, p1-11, 11p

Subject Terms: WARPAGE in electronic circuits, THERMAL expansion, INDUSTRIAL applications

Authors: Hans-Peter Schro¨cker, Manfred L. Husty, J. Michael McCarthy

Superior Title: Journal of Mechanical Design. Sep2007, Vol. 129 Issue 9, p924-929. 6p.

Subject Terms: *ELECTRONIC circuit design, *LOGIC design, *ALGORITHMS, *UNITS of measurement

Authors: Sweetland, Matthew, Lienhard V, John H.

Superior Title: Journal of Heat Transfer. Feb2003, Vol. 125 Issue 1, p164. 11p. 3 Diagrams, 13 Graphs.

Subject Terms: *INTEGRATED circuits, *ELECTRONIC circuits testing

Authors: Domguia, U. Simo, Tchakui, M. V., Simo, H., Woafo, P.

Superior Title: Journal of Vibration & Acoustics; Dec2017, Vol. 139 Issue 6, p1-11, 11p

Subject Terms: ELECTRONIC circuits, ELECTROMECHANICAL devices, OSCILLATIONS

Authors: Bo Huang, Chen-Yu Hsieh, Golnaraghi, Farid, Moallem, Mehrdad

Superior Title: Journal of Vibration & Acoustics; Oct2015, Vol. 137 Issue 5, p051014-1-051014-11, 11p

Subject Terms: MOTOR vehicle springs & suspension, ELECTRONIC circuits, POWER electronics, ENERGY harvesting, FORCE & energy

Authors: Jia Xi, Xinduo Zhai, Jun Wang, Donglun Yang, Mao Ru, Fei Xiao, Li Zhang, Chi Ming Lai

Superior Title: Journal of Electronic Packaging; Sep2015, Vol. 137 Issue 3, p031016-1-031016-7, 7p

Subject Terms: IRON-nickel alloys, THERMAL properties, MICROELECTRONICS, ELECTRONIC circuits, STRUCTURAL design

Superior Title: Mechanical Engineering. May2016, Vol. 138 Issue 5, p20-20. 1/2p.

Subject Terms: GOLD alloys, ELECTRONIC circuits, ELECTRIC conductivity

Authors: Schwaab, Quentin, Weiss, Julien

Superior Title: Journal of Fluids Engineering; Jan2015, Vol. 137 Issue 1, p1-8, 8p

Subject Terms: TURBULENT boundary layer, BOUNDARY layer (Aerodynamics), QUANTUM perturbations, ELECTRONIC circuits, ACOUSTIC resonators

Authors: Sungbum Kang, Ume, I. Charles

Superior Title: Journal of Electronic Packaging; Sep2014, Vol. 136 Issue 3, p1-5, 5p

Subject Terms: ELECTRONIC packaging equipment, WARPAGE in electronic circuits, FABRICATION (Manufacturing), ELECTRONIC equipment, CHIP scale packaging

Authors: Sundén, Bengt, Gongnan Xie

Superior Title: Journal of Electronic Packaging; Jun2014, Vol. 136 Issue 2, p1-5, 5p

Subject Terms: THERMAL resistance, ELECTRONIC circuits, COOLING, HEAT sinks (Electronics), ELECTRONIC packaging

Authors: Peisheng Liu, Jinlan Wang, Liangyu Tong, Yujuan Tao

Superior Title: Journal of Electronic Packaging; Jun2014, Vol. 136 Issue 2, p1-7, 7p

Subject Terms: WAFER level packaging, MICROELECTROMECHANICAL systems, ELECTRONIC circuits, ELECTRONIC packaging, THREE-dimensional imaging

Authors: Igra, Dan, Igra, Ozer, Houas, Lazhar, Jourdan, Georges

Superior Title: Journal of Fluids Engineering; Oct2012, Vol. 134 Issue 10, p45021-45024, 4p

Subject Terms: SHOCK waves, SIMULATION methods & models, ELECTRONIC systems, ELECTRONIC circuit design, MOTION

Authors: Askari Faraliani, A. F., Al-Bassyiouni, M., Dasgupta, A.

Superior Title: Journal of Electronic Packaging; Dec2011, Vol. 133 Issue 4, p41012.1-41012.12, 12p

Subject Terms: ELECTRONIC circuit design, DYNAMIC loads, MECHANICAL shock, TRANSIENTS (Dynamics), STRAINS & stresses (Mechanics), FINITE element method, SIMULATION methods & models

Authors: Askari Farahani, A. F., Al-Bassylouni, M., Dasgupta, A.

Superior Title: Journal of Electronic Packaging; Dec2011, Vol. 133 Issue 4, p41010.1-41010.10, 10p

Subject Terms: DYNAMIC loads, ELECTRONIC circuit design, TRANSIENTS (Dynamics), MECHANICAL shock, ELECTRODYNAMICS, FOURIER transforms

Authors: Bissuel, Valentin, Brizoux, Michel, Grivon, Arnaud, Monier-Vinard, Eric, Pires, Fabrice

Superior Title: Journal of Electronic Packaging; Sep2011, Vol. 133 Issue 3, p310131-310138, 8p

Subject Terms: PRINTED circuits, INTEGRATED circuit interconnections, ELECTRONIC circuit design, TEMPERATURE, AIR conditioning electric equipment, COOLING

Authors: Sundararaj, S., Selladurai, V.

Superior Title: Journal of Fluids Engineering; Oct2010, Vol. 132 Issue 10, p101104.1-101104.9, 9p, 3 Diagrams, 1 Chart, 8 Graphs

Subject Terms: JETS (Fluid dynamics), MIXING circuits, TRAJECTORIES (Mechanics), ELECTRONIC circuits, ARBITRARY constants, MOMENTUM (Mechanics)

Authors: Katsurayama, Satoru, Tohmyoh, Hironori

Superior Title: Journal of Electronic Packaging; Sep2009, Vol. 131 Issue 3, p031005:1-031005:5, 5p, 2 Charts, 2 Graphs

Subject Terms: INTEGRATED circuits, ELECTRONIC packaging, ELECTRONIC circuits, MICROELECTRONICS, INFORMATION technology

Authors: Ji-Young Yoon, Ilho Kim, Soon-Bok Lee

Superior Title: Journal of Electronic Packaging; Jun2009, Vol. 131 Issue 2, p021012:1-021012:8, 8p, 10 Diagrams, 3 Charts, 16 Graphs

Subject Terms: DIFFUSION, MOISTURE, HUMIDITY, INTEGRATED circuits, ELECTRONIC circuits, FINITE element method, NUMERICAL analysis

Authors: Faraji, Mustapha, El Qarnia, Hamid

Superior Title: Journal of Electronic Packaging; Jun2009, Vol. 131 Issue 2, p021011:1-021011:10, 10p, 3 Diagrams, 4 Charts, 5 Graphs

Subject Terms: COOLING, HEAT sinks (Electronics), HEAT transfer, ENERGY transfer, FUSION (Phase transformation), ELECTRONIC circuits, MATHEMATICAL models