Authors: Doany, Fuad E.¹ doany@us.ibm.com, Schow, Clint L.¹, Baks, Christian W.¹, Kuchta, Daniel M.¹, Pepeijugoski, Petar¹, Schares, Laurent¹, Budd, Russell¹, Libsch, Frank¹, Dangel, Roger, Horst, Folkert², Offrein, Bert J.², Kash, Jeffrey A.¹

Superior Title: IEEE Transactions on Advanced Packaging. May2009, Vol. 32 Issue 2, p345-359. 15p. 1 Black and White Photograph, 24 Graphs.

Subject Terms: *INTEGRATED circuits, OPTICAL interconnects, INTEGRATED optics, COMPLEMENTARY metal oxide semiconductors, PRINTED circuits, ELECTRONIC circuits

Authors: Cho, Han Seo¹, Chu, Kun-Mo², Kang, Saekyoung², Hwang, Sung Hwan², Rho, Byung Sup³, Kim, Weon Hyo⁴, Kim, Joon-Sung^1,5, Kim, Jang-Joo⁶, Park, Hyo-Hoon²

Superior Title: IEEE Transactions on Advanced Packaging. Feb2005, Vol. 28 Issue 1, p114-120. 7p.

Subject Terms: *WELDING, OPTICAL interconnects, INTEGRATED optics, ELECTRIC circuits, ELECTRONIC circuits, MINIATURE electronic equipment

Authors: Griese, Elmar

Superior Title: IEEE Transactions on Advanced Packaging. Aug2001, Vol. 24 Issue 3, p375. 9p. 17 Diagrams.

Subject Terms: OPTICAL interconnects, INTEGRATED optics, COMPUTER circuits

Authors: Joo, Gwan-Chong, Lee, Sang-Hwan

Superior Title: IEEE Transactions on Advanced Packaging. Nov2000, Vol. 23 Issue 4, p681. 5p. 3 Black and White Photographs, 4 Diagrams, 1 Chart, 2 Graphs.

Subject Terms: COUPLINGS (Gearing), INTEGRATED optics

Authors: Takara, Hideyuki, Tanaka, Nobuyuki

Superior Title: IEEE Transactions on Advanced Packaging. May2000, Vol. 23 Issue 2, p323. 5p. 4 Black and White Photographs, 4 Diagrams, 7 Graphs.

Subject Terms: OPTICAL interconnects, INTEGRATED optics

Authors: Yaomin Lin, Wenning Liu, Shi, Frank G.

Superior Title: IEEE Transactions on Advanced Packaging; Aug2006, Vol. 29 Issue 3, p520-524, 5p, 2 Black and White Photographs, 7 Diagrams, 3 Charts, 2 Graphs

Subject Terms: SEALING (Technology), CURING, FIBER optics, INTEGRATED optics, ELECTRONIC packaging, ELECTRONICS

Authors: Kun-Mo Chu, Jung-Hwan Choi, Jung-Sub Lee, Han Seo Cho, Seong-Ook Park, Hyo-Hoon Park, Duk Young Jeon

Superior Title: IEEE Transactions on Advanced Packaging; Aug2006, Vol. 29 Issue 3, p409-414, 6p, 7 Black and White Photographs, 7 Diagrams, 1 Chart, 3 Graphs

Subject Terms: SEALING (Technology), OPTICAL interconnects, INTEGRATED optics, INTEGRATED circuits, FLIP chip technology, ELECTRONIC packaging

Authors: Deeds, Michael A., Sandborn, Peter A.

Superior Title: IEEE Transactions on Advanced Packaging; Nov2005, Vol. 28 Issue 4, p612-618, 7p

Subject Terms: OPTICAL fibers, MICROSTRUCTURE, MICROELECTROMECHANICAL systems, INTEGRATED optics, SILICON, INDIUM

Authors: Gee-Kung Chang, Guidotti, Daniel, Fuhan Liu, Yin-Jung Chang, Zhaoran Huang, Sundaram, Venkatesh, Balaraman, Devarajan, Hegde, Shashikant, Tummala, Rao R.

Superior Title: IEEE Transactions on Advanced Packaging; May2004, Vol. 27 Issue 2, p386-397, 12p

Subject Terms: OPTICAL interconnects, SYSTEMS on a chip, EMBEDDED computer systems, OPTOELECTRONICS, ELECTROOPTICS, INTEGRATED optics, OPTICAL waveguides

Authors: Jokerst, Nan M., Gaylord, Thomas K., Glytsis, E., Brooke, Martin A., Cho, S., Nonaka, T., Suzuki, T., Geddis, Demetris L., Shin, Jaemin, Villalaz, R., Hall, J., Chellapa, Ananthasayanam, Vrazel, M.

Superior Title: IEEE Transactions on Advanced Packaging; May2004, Vol. 27 Issue 2, p376-385, 10p

Subject Terms: INTEGRATED circuits, OPTICAL interconnects, ELECTRONIC circuits, EMBEDDED computer systems, INTEGRATED circuit interconnections, INTEGRATED optics