Authors: Huang, Chiung-Shiann, Huang, S. H.
Contributors: 土木工程學系, Department of Civil Engineering
Subject Terms: analytical solution, Fourier cosine series, vibrations, FGM rectangular plates, Mindlin plate theory
Relation: http://dx.doi.org/10.3390/ma13173820; http://hdl.handle.net/11536/155395; MATERIALS; WOS:000569664100001
Authors: Kong, Lingfei, Cao, Shuai, Chin, Jih-Hua, Si, Yue, Miao, Falin, Li, Yan
Contributors: 機械工程學系, Department of Mechanical Engineering
Subject Terms: Deep hole drilling, Drilling tool vibration, Independence mode space, Semiactive control
Relation: http://dx.doi.org/10.1016/j.ijmachtools.2020.103525; http://hdl.handle.net/11536/154595; INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE; WOS:000536173400002
Authors: Huang, Yang, Chen, Chiun-Hsun, Huang, Chi-Jui
Contributors: 機械工程學系, 資訊管理與財務金融系 註：原資管所+財金所, Department of Mechanical Engineering, Department of Information Management and Finance
Subject Terms: Feature extraction, Fault detection, Dimensionality reduction, Vibrations, Data models, Fault diagnosis, Time-domain analysis, Motor fault detection, recurrent neural network, variational autoencoder
Relation: http://dx.doi.org/10.1109/ACCESS.2019.2940769; http://hdl.handle.net/11536/155302; IEEE ACCESS; WOS:000560318900001
Authors: Huang, C. S., Lee, M. C., Chang, M. J.
Contributors: 土木工程學系, Department of Civil Engineering
Subject Terms: Stability, vibration, internally cracked plate, MLS-Ritz method
Relation: http://dx.doi.org/10.1142/S0219455418501055; http://hdl.handle.net/11536/148151; INTERNATIONAL JOURNAL OF STRUCTURAL STABILITY AND DYNAMICS; WOS:000444763900004
Authors: Yang, Y. B., Li, Mei, Zhang, Bin, Wu, Yuntian, Yang, Judy P.
Contributors: 土木工程學系, Department of Civil Engineering
Subject Terms: Cancellation, eccentricity, resonance, monosymmetric I-beam, torsional vibration, train
Relation: http://dx.doi.org/10.1142/S0219455418501110; http://hdl.handle.net/11536/148152; INTERNATIONAL JOURNAL OF STRUCTURAL STABILITY AND DYNAMICS; WOS:000444763900010
Contributors: 機械工程學系, Department of Mechanical Engineering
Subject Terms: Tensile testing, ultrasonic vibration-assisted forming (UAF), strain-induced martensitic transformation, stainless steel
Relation: http://dx.doi.org/10.1080/02533839.2018.1473805; http://hdl.handle.net/11536/148175; JOURNAL OF THE CHINESE INSTITUTE OF ENGINEERS; WOS:000445131000006
Contributors: 電子物理學系, Department of Electrophysics
Subject Terms: 10 fs pulse UV laser, Vibration dynamics, 9,9'-bianthryl, Ultrafast spectroscopy
Relation: http://dx.doi.org/10.1016/j.chemphys.2017.12.016; http://hdl.handle.net/11536/148012; CHEMICAL PHYSICS; WOS:000441753300020
Authors: Korepanov, Vitaly, Yu, Chun-Chieh, Hamaguchi, Hiro-o
Contributors: 應用化學系, 應用化學系分子科學碩博班, Department of Applied Chemistry, Institute of Molecular science
Subject Terms: hyper-Raman spectroscopy, ice, intermolecular vibration, libration, liquid water
Relation: http://dx.doi.org/10.1002/jrs.5459; http://hdl.handle.net/11536/148456; JOURNAL OF RAMAN SPECTROSCOPY; WOS:000449999600001
Authors: Wang, Yu-Wei, Pan, Tse-Yu, Chang, Yung-Ju, Hu, Min-Chun
Contributors: 資訊工程學系, Department of Computer Science
Subject Terms: haptic feedback, vibration, pressure, tactile, virtual reality
Relation: http://dx.doi.org/10.1109/AIVR46125.2019.00041; http://hdl.handle.net/11536/154271; 2019 IEEE INTERNATIONAL CONFERENCE ON ARTIFICIAL INTELLIGENCE AND VIRTUAL REALITY (AIVR); WOS:000526055100031
Authors: Lee, Chienliang, Wang, Yenpo
Contributors: 土木工程學系, Department of Civil Engineering
Subject Terms: Micro-vibration, High technology factory, Moving loads, Time history analysis, Fragility surfaces
Relation: http://dx.doi.org/10.1088/1755-1315/283/1/012067; http://hdl.handle.net/11536/153315; 5TH INTERNATIONAL CONFERENCE ON ENVIRONMENTAL SCIENCE AND CIVIL ENGINEERING (ESCE2019); WOS:000494643600067
Authors: Wu, Yi-Cheng, Kao, Yung-Hua, Chao, Paul C. -P., Wey, Chin-Long, Sauter, Thilo, Fitrah, Eka P., Pandey, Rajeev
Contributors: 電子工程學系及電子研究所, 電機工程學系, 電控工程研究所, 電機資訊國際碩士學位學程, Department of Electronics Engineering and Institute of Electronics, Department of Electrical and Computer Engineering, Institute of Electrical and Control Engineering, EECS International Graduate Program-Master
Subject Terms: PWM drive, trans-impedance amplifier, analog-to-digital converter, time-to-digital converter, vibration sensor
Relation: http://hdl.handle.net/11536/152490; 2018 IEEE SENSORS; WOS:000468199300274
Availability: http://hdl.handle.net/11536/152490
Authors: Wang, Yan-Di, Liu, Chun-Hui, Jiang, Ren-Yi, Lin, Bor-Shing, Lin, Bor-Shyh
Contributors: 光電系統研究所, 影像與生醫光電研究所, Institute of Photonic System, Institute of Imaging and Biomedical Photonics
Subject Terms: Respiratory sound, Vibration of human body, Wireless transmission, Adaptive filter
Relation: http://dx.doi.org/10.1007/978-3-319-63856-0_21; http://hdl.handle.net/11536/146188; ADVANCES IN INTELLIGENT INFORMATION HIDING AND MULTIMEDIA SIGNAL PROCESSING, PT I; WOS:000434869600021
Authors: Kong, Lingfei, Chin, Jih-Hua, Li, Yan, Lu, Yanjun, Li, Pengyang
Contributors: 機械工程學系, Department of Mechanical Engineering
Subject Terms: Deep hole drilling, MR fluid vibration damper, Drilling tools system, Vibration suppression
Relation: http://dx.doi.org/10.1016/j.jmatprotec.2014.05.029; http://hdl.handle.net/11536/25019; JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Authors: Chung, Tien-Kan, Yeh, Po-Chen, Lee, Hao, Lin, Cheng-Mao, Tseng, Chia-Yung, Lo, Wen-Tuan, Wang, Chieh-Min, Wang, Wen-Chin, Tu, Chi-Jen, Tasi, Pei-Yuan, Chang, Jui-Wen
Contributors: 機械工程學系, 國際半導體學院, Department of Mechanical Engineering, International College of Semiconductor Technology
Subject Terms: vibration, electromagnetic, self-powered, energy harvester, wireless, sensing, milling monitoring, attachable, cutter condition
Relation: http://dx.doi.org/10.3390/s16030269; http://hdl.handle.net/11536/133823; SENSORS; WOS:000373713600001
Authors: Hung, Chiao-Fang, Chung, Tien-Kan, Yeh, Po-Chen, Chen, Chin-Chung, Wang, Chieh-Min, Lin, Shin-Hung
Contributors: 機械工程學系, Department of Mechanical Engineering
Subject Terms: Energy harvester, 3-axis, 3-dimeniosnal, piezoelectric, mechanical, vibration
Relation: http://dx.doi.org/10.1109/JSEN.2015.2444993; http://hdl.handle.net/11536/128129; IEEE SENSORS JOURNAL; WOS:000360072500032
Authors: Huang, Chien-Yang, Tsai, Jia-Lin
Contributors: 機械工程學系, Department of Mechanical Engineering
Subject Terms: Vibration damping, nanocomposites, composite laminates, micromechanical analysis
Relation: http://dx.doi.org/10.1177/0021998314521257; http://hdl.handle.net/11536/124313; JOURNAL OF COMPOSITE MATERIALS; WOS:000349764000004
Authors: Fu, Shiang Chih, Cheng, Stone
Contributors: 機械工程學系, Department of Mechanical Engineering
Subject Terms: PMSM, adaptive IIR notch filter, tortional vibration, suppress vibration, dual-inertia modle, auto-tuning notch filter
Relation: http://dx.doi.org/10.1109/ICSMC.2009.5346192; http://hdl.handle.net/11536/15127; 2009 IEEE INTERNATIONAL CONFERENCE ON SYSTEMS, MAN AND CYBERNETICS (SMC 2009), VOLS 1-9
Authors: Liu, Chih-Chieh, Hung, Ching-Hua, Chien, Huai-Ching
Contributors: 機械工程學系, Department of Mechanical Engineering
Subject Terms: vital signs, detection system, vehicle vibration, velocity sensors, ground noise
Relation: http://hdl.handle.net/11536/123937; JOURNAL OF VIBROENGINEERING; WOS:000345241900018
Availability: http://hdl.handle.net/11536/123937
Authors: Hung, Shao-Kang, Cheng, Chiao-Hua, Chiang, Ming-Li, Chieh, Jih-Wei
Contributors: 機械工程學系, Department of Mechanical Engineering
Subject Terms: Acceleration measurement, CD recording, dynamic response, optical position measurement, vibration measurement
Relation: http://dx.doi.org/10.1109/TIM.2013.2282427; http://hdl.handle.net/11536/23769; IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT; WOS:000331445400020
Authors: Huang, C. S., Chan, C. W.
Contributors: 土木工程學系, Department of Civil Engineering
Subject Terms: Vibrations, cracked plates, cracked functions, Ritz method, moving least-squares approach
Relation: http://dx.doi.org/10.1142/S0219455413500600; http://hdl.handle.net/11536/23365; INTERNATIONAL JOURNAL OF STRUCTURAL STABILITY AND DYNAMICS; WOS:000329311600004