Authors: Swaminathan, Madhavan
Contributors: Georgia Institute of Technology. School of Electrical and Computer Engineering, Georgia Institute of Technology. Office of Sponsored Programs
Subject Terms: Electronic ceramics, Electronic circuit design
File Description: 8252224 bytes; application/pdf
Relation: School of Electrical and Computer Engineering; Project no. E-21-K31; http://hdl.handle.net/1853/9553
Availability: http://hdl.handle.net/1853/9553
Authors: Baldwin, Daniel F.
Contributors: George W. Woodruff School of Mechanical Engineering, Office of Sponsored Programs, Georgia Institute of Technology. Office of Sponsored Programs, College of Engineering, Georgia Institute of Technology. School of Mechanical Engineering
Subject Terms: Electronic circuits Design and testing, Microelectronic packaging
File Description: 4468475 bytes; application/pdf
Relation: OSP Final Research Reports; School of Mechanical Engineering; Project no. E-25-A80; http://hdl.handle.net/1853/9558
Availability: http://hdl.handle.net/1853/9558
Authors: Swaminathan, Madhavan
Contributors: School of Electrical and Computer Engineering, College of Engineering, Georgia Institute of Technology. Office of Sponsored Programs, Office of Sponsored Programs, Georgia Institute of Technology. School of Electrical and Computer Engineering
Subject Terms: Electronic ceramics, Electronic circuit design
File Description: 8252224 bytes; application/pdf
Relation: OSP Final Research Reports; School of Electrical and Computer Engineering; Project no. E-21-K31; http://hdl.handle.net/1853/9553
Availability: http://hdl.handle.net/1853/9553
Authors: Venkateswaran, H.
Contributors: Georgia Institute of Technology. Office of Sponsored Programs, Georgia Institute of Technology. College of Computing
Subject Terms: Computational complexity, Electronic circuits
File Description: application/pdf
Relation: College of Computing; Project no. C-36-690; 467511; http://hdl.handle.net/1853/49823
Availability: http://hdl.handle.net/1853/49823
Authors: Howard, Duane Clarence
Contributors: Cressler, John D., Tentzeris, Manos M., Papapolymerou, John, Wang, Hua, Henry, Todd J., School of Electrical and Computer Engineering, College of Engineering, Electrical and Computer Engineering
Subject Terms: Microwave systems, RF systems, Tunable circuits, Automated testing, Built-in-self testing, Self-healing, Integrated circuits, Microwave integrated circuits, Electronic circuits, Microwave circuits
File Description: application/pdf
Relation: http://hdl.handle.net/1853/51823
Availability: http://hdl.handle.net/1853/51823
Authors: Pant, Pankaj
Contributors: Chatterjee, Abhijit, School of Electrical and Computer Engineering, College of Engineering, Electrical and Computer Engineering
File Description: 236 bytes; text/html; application/pdf
Relation: 562776; http://hdl.handle.net/1853/13556
Availability: http://hdl.handle.net/1853/13556
Authors: Mukherjee, Souvik
Contributors: Swaminathan, Madhavan, Fathianathan, Mervyn, Lim, Sung Kyu, Peterson, Andrew, Tentzeris, Manos, Electrical and Computer Engineering
Subject Terms: Layout-level, Circuit sizing, Liquid crystalline polymer, Design-for-manufacturability, Yield optimization, Statistical analysis, Radio frequency integrated circuits Design and construction, Mathematical optimization, Manufacturing processes, Electronic circuits Design and construction
File Description: application/pdf
Relation: http://hdl.handle.net/1853/16131
Availability: http://hdl.handle.net/1853/16131
Authors: Yun, Wansuk
Contributors: Swaminathan, Madhavan, Dolittle, Alan, Iyer, Mahadevan, Kenney, James, Sitaraman, Suresh, Electrical and Computer Engineering
Subject Terms: Embedded passives, Characterization, RF front-end, Modeling, Liquid Crystalline Polymer (LCP), System-on-Package (SOP), Polymer liquid crystals, Electronic circuits
File Description: application/pdf
Relation: http://hdl.handle.net/1853/19785
Availability: http://hdl.handle.net/1853/19785
Authors: Mukherjee, Souvik
Contributors: Swaminathan, Madhavan, Fathianathan, Mervyn, Lim, Sung Kyu, Peterson, Andrew, Tentzeris, Manos, School of Electrical and Computer Engineering, College of Engineering, Electrical and Computer Engineering
Subject Terms: Layout-level, Circuit sizing, Liquid crystalline polymer, Design-for-manufacturability, Yield optimization, Statistical analysis, Radio frequency integrated circuits Design and construction, Mathematical optimization, Manufacturing processes, Electronic circuits Design and construction
File Description: application/pdf
Relation: http://hdl.handle.net/1853/16131
Availability: http://hdl.handle.net/1853/16131
Authors: Yun, Wansuk
Contributors: Swaminathan, Madhavan, Dolittle, Alan, Iyer, Mahadevan, Kenney, James, Sitaraman, Suresh, School of Electrical and Computer Engineering, College of Engineering, Electrical and Computer Engineering
Subject Terms: Embedded passives, Characterization, RF front-end, Modeling, Liquid Crystalline Polymer (LCP), System-on-Package (SOP), Polymer liquid crystals, Electronic circuits
File Description: application/pdf
Relation: http://hdl.handle.net/1853/19785
Availability: http://hdl.handle.net/1853/19785
Authors: Deodhar, Vinita Vasant
Contributors: Davis, Jeffrey A., Kohl, Paul, Meindl, James, Swaminathan, Madhavan, Wills, D. Scott, School of Electrical and Computer Engineering, College of Engineering, Electrical and Computer Engineering
Subject Terms: Digital integrated circuits, Electronic circuits, High throughput, Interconnect, Low-power, Metal oxide semiconductors, Wave-pipelining, Complementary, Interconnects (Integrated circuit technology), Integrated circuits, Digital electronics
File Description: 1295686 bytes; application/pdf
Relation: http://hdl.handle.net/1853/7503
Availability: http://hdl.handle.net/1853/7503
Authors: Akgul, Bilge Ebru Saglam
Contributors: Mooney, Vincent John, III, Blough, Douglas M., Dorsey, John, Hamblen, James, Ramachanan, Umakishore, School of Electrical and Computer Engineering, College of Engineering, Electrical and Computer Engineering
Subject Terms: Shared-memory, SoC, Lock-based synchronization, Real-time systems, Embedded computer systems Design and construction, Semiconductors Design and construction, Application specific integrated circuits Design and construction, Electronic circuits Design and construction
File Description: 704447 bytes; application/pdf
Relation: http://hdl.handle.net/1853/5253
Availability: http://hdl.handle.net/1853/5253
Authors: Matoglu, Erdem
Contributors: Swaminathan, Madhavan, Electrical and Computer Engineering
Subject Terms: Digital electronics Design and construction, Radio frequency, Integrated circuits Design and construction, Electronic circuit design
File Description: 5939153 bytes; application/pdf
Relation: http://hdl.handle.net/1853/9446
Availability: http://hdl.handle.net/1853/9446
Authors: Matoglu, Erdem
Contributors: Swaminathan, Madhavan, School of Electrical and Computer Engineering, College of Engineering, Electrical and Computer Engineering
Subject Terms: Digital electronics Design and construction, Radio frequency, Integrated circuits Design and construction, Electronic circuit design
File Description: 5939153 bytes; application/pdf
Relation: http://hdl.handle.net/1853/9446
Availability: http://hdl.handle.net/1853/9446
Authors: Hobbs, Joseph Martin
Contributors: Tummala, Rao R., School of Electrical and Computer Engineering, College of Engineering, Electrical and computer engineering, Electric engineering
Subject Terms: Microelectronics Design, Dielectrics, Capacitors, Electronic circuits Noise
File Description: application/pdf
Relation: 638829; http://hdl.handle.net/1853/32968
Availability: http://hdl.handle.net/1853/32968
Authors: Na, Nanju
Contributors: Swaminathan, Madhavan, Electrical and Computer Engineering
Subject Terms: Electronic packaging, Switching circuits, Electronic circuits, Electronic noise
File Description: text/html; application/pdf
Relation: 607942; http://hdl.handle.net/1853/14812
Availability: http://hdl.handle.net/1853/14812
Authors: Na, Nanju
Contributors: Swaminathan, Madhavan, School of Electrical and Computer Engineering, College of Engineering, Electrical and Computer Engineering
Subject Terms: Electronic packaging, Switching circuits, Electronic circuits, Electronic noise
File Description: text/html; application/pdf
Relation: 607942; http://hdl.handle.net/1853/14812
Availability: http://hdl.handle.net/1853/14812
Authors: Balachandran, Ganesh Kumar
Contributors: Allen, Phillip E., School of Electrical and Computer Engineering, College of Engineering, Electrical and computer engineering
Subject Terms: Electronic circuit design, Metal oxide semiconductors, Complementary
File Description: application/pdf
Relation: 622877; http://hdl.handle.net/1853/15405
Availability: http://hdl.handle.net/1853/15405
Authors: Raghunathan, Rajiv
Contributors: Sitaraman, Suresh K., George W. Woodruff School of Mechanical Engineering, College of Engineering, Mechanical engineering
Subject Terms: Packaging, Packaging Testing, Electronic circuits Design and construction
File Description: application/pdf
Relation: 562921; http://hdl.handle.net/1853/18849
Availability: http://hdl.handle.net/1853/18849
Authors: Fennell, Brett Jamerson
Contributors: Baldwin, Daniel F., George W. Woodruff School of Mechanical Engineering, College of Engineering, Mechanical engineering
Subject Terms: Packaging Testing, Packaging, Electronic circuits Design and construction
File Description: application/pdf
Relation: 562125; http://hdl.handle.net/1853/16681
Availability: http://hdl.handle.net/1853/16681